Global Headquarters
No. 398, Xinhu 1st Rd, Neihu District, Taipei City, 114, Taiwan
13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
Provides seamless and secure contact between surfaces.
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.